The modules in the H300 series are suitable for spot/track, spray and wide-slot bonding at normal application speeds and with straightforward adhesives within a viscosity range of up to 20,000 mPas/s. The maximum switching capacity is 4,000 t/min (depending on the control system).
Compressed air is supplied to open the module quickly.
In the case of the wide-slot module, particular attention has been paid to ensuring a precise fit within the application head and accurate glue fine-tuning. As several of these modules are usually installed in a cluster within the application head, an precisely adjustable glue volume is extremely important for uniform application.
The modules in the H300 series are suitable for dot/bead, spray and wide-slot bonding at normal application speeds and with straightforward adhesives within a viscosity range of up to 20,000 mPas/s. The maximum switching capacity is 4,000 t/min (depending on the control system).
Compressed air is supplied to open the module quickly.
The spray module has an additional inlet for spray air. When this air exits through the symmetrically arranged holes, it ensures uniform agitation of the adhesive. The modules are installed in application heads with an integrated heat exchanger. The spray application is applied with sharp edges and is barely visible on the substrate.
The H400 is ideal for applying high-viscosity materials and large quantities of adhesive.
With a maximum bore diameter of up to 3.6 mm, it delivers a particularly high adhesive flow rate.
